Gold–aluminium intermetallic - Wikipedia
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints | I am a Manufacturing Process Engineer (MPE)
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient | Scientific Reports
Cross-Sectional Analysis — Elmet
The Role of Aluminium in Continuous Galvanizing - Ark Novin
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
The cross sections of the as-diffusion alloyed intermetallic layer... | Download Scientific Diagram
The HDG Coating | American Galvanizers Association
Cross section morphology of Cu 6 Sn 5 IMC grown at the interface of... | Download Scientific Diagram
Microsection / Cross-Section Analysis
Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology - ScienceDirect
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections | SpringerLink
Figure 2 from Investigation of the wetting properties of Cu6Sn5 intermetallic compound | Semantic Scholar
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging | Scientific Reports
Figure 2 from Investigating the activation energy of intermetallic layer growth in SAC305 and Innolot alloys | Semantic Scholar
Microsection | BGA Cross Section Analysis
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene | ACS Applied Materials & Interfaces
Hurtony Tamás
Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate
Cross-Sectional Analysis — Elmet
